题目：Advanced RF and SI Techniques in Wireless System‐in‐Packages
时间：2015年12月11日（星期五），上午10:00-12:00
地点：玉泉校区，行政楼111
报告人：Dr. Tzyy‐Sheng Jason Horng
Brief Bio: Dr. Horng was was awarded with the 2011 Advanced Semiconductor Engineering (ASE) Inc. Chair Professorship and the 2012 Outstanding Research Award at the National Sun Yat‐Sen University. Dr. Horng is the Founder Chair of the IEEE MTT‐S Tainan Chapter, and currently an Associate Editor of the IEEE Transactions on Microwave Theory and Techniques, and a member of the IEEE MTT‐S Technical Committee MTT‐10 and MTT‐20.
Abstract：System‐in‐package (SiP) technology is a key to miniaturization of wireless communication devices. The high‐frequency research and development activities include RF integrated circuits, integrated passive devices, stacked‐chips package structures, antennas and passives embedded in package substrate, broadband modeling of 3‐D interconnects and RF system signal integrity.